Solar PV
Spatial ALD solves current issues in making organic and Perovskite flexible solar cells commercially viable.
To extend the shelf life of products, packaging manufacturers often require high barrier properties of their materials to prevent permeation of gases such as oxygen, moisture, and volatile organic compounds. Not only has the packaging industry high demands for barrier layers, but these also need to be applied at very high speed. Superspatial ALD is the only system that can meet uptime and throughput requirements of the industry.
Sustainable packaging
Spatial ALD can be utilized to deposit thin films of materials like aluminium oxide (Al2O3) with precise thickness control, creating ultra-thin barrier layers that effectively block the passage of gases. Due to these ultra-thin layers, materials become easier to recycle. These thin layers can be applied on to other materials than plastics while maintaining its protective properties, opening up the possibility to move towards a plastic-free packaging industry.
Functionalizing surfaces
Besides providing barrier properties to packaging materials, spatial ALD can also be used to add additional functionalities. Think of corrosion protection where thin films applied on metal packaging prevent it from reacting with the environment, enhancing the durability and longevity of the packaging. With thin layers of conductive materials, transparent conductive films can be incorporated into flexible electronics for smart packaging. Or thin layers of functional coatings can provide specific properties such as anti-fogging, anti-static, or anti-microbial properties.
How spatial ALD benefits packaging
Extended shelf life
Due to better barrier and corrosion protection layers applied by spatial ALD, shelf life of packaged products can be improved.
Easier recyclable
Thinner layers with better barrier properties make packaging easier to recycle and open up possibilities for circular materials.
Added functionalities
Complex, multi-materials can be applied to add functionality to surfaces of packaged materials while maintaining a high production throughput due to the unique web-handling and deposition technique.
